Huada Semiconductor and Dongfeng Motor Group Technology Center jointly build an automotive chip laboratory
Source: BGI Semiconductor 2021-04-21
Recently, BGI and Dongfeng Motor Group Technology Center signed a cooperation agreement on the "Automotive Independent Chip Research Joint Laboratory" in Shanghai, and held a laboratory inauguration ceremony.
Liu Jinmei, senior deputy general manager of Huada Semiconductor, said that this cooperation has outstanding strategic and practical significance in the context of the "core shortage" of China's auto industry. The automobile industry calls for domestic chips. As China's integrated circuit "national team", Huada Semiconductor must strengthen industry cooperation and core technology research to ensure the supply of chips and support the healthy development of China's automobile industry in the spirit of seizing the day.
Tan Minqiang, director of the Dongfeng Motor Group Technology Center, said that the signing of an agreement between Dongfeng Technology Center and Huada Semiconductor to jointly build an automotive electronics laboratory opened the prelude to the strategic cooperation between the two parties. The two parties will give full play to the advantages of central enterprises, strengthen application traction, and implement cooperation to achieve a stable and controllable automotive industry supply chain.