Source: Big Semiconductor Industry Network

STMicroelectronics will adopt Qualcomm Technologies, Inc.'s technology to develop innovative software solutions by participating in the Qualcomm® Platform platform solution ecosystem plan. This cooperation will further expand ST's leading position in sensor technology.

In this plan, STMicroelectronics provides OEM manufacturers with pre-verified MEMS and other sensor software, providing advanced features for next-generation smart phones, connected PCs, Internet of Things and wearable devices. Recently, Qualcomm Technology has pre-selected ST's latest high-precision, low-power, motion tracking IC with smart sensor software and ST's most accurate pressure sensor in its latest advanced 5G mobile reference platform.

The new motion tracking sensor iNEMO LSM6DST is a 6-axis inertial measurement unit (IMU) that integrates a 3-axis digital accelerometer and a 3-axis gyroscope in a compact and efficient system-in-package. The power consumption of the LSM6DST is at the lowest level in the industry, 0.55mA in high-performance mode, and only 4μA in accelerometer-only mode. It can realize full-time high-accuracy motion tracking with extremely low power consumption. LPS22HH is ST's industry's first low-noise (0.65Pa) and high-accuracy (±0.5hPa) pressure sensor with I3C bus. LSM6DST and LPS22HH can improve the accuracy of the position tracking function while meeting the most stringent power budget. limit.

For imaging applications, LSM6DST fully supports EIS and OIS (electronic and optical image stabilization) applications, because the module includes dedicated configurable OIS and auxiliary SPI signal processing paths, configurable gyroscope and accelerometer signal paths, and in turn, The auxiliary SPI and the main interface (SPI / I2C & MIPI I3CSM) can configure OIS.

Thanks to ST's robust and mature low-power ThELMA process technology, LSM6DST can support and simplify low-power circuit design, and provide I2C, MIPII3C® or SPI interfaces to connect sensors and application processors. In this inertial unit, 9 KB FIFO memory supports dynamic data batch processing, 16 finite state machines can identify programmable data sequences from sensors, and further reduce system-level power consumption.

Manvinder Singh, Vice President of Qualcomm’s Product Management Department, said: “ST has long recognized the importance of sensors in Qualcomm’s solutions and has been an important partner for us for many years. ST’s new interface (such as MIPI I3C) sensors Walking in the forefront of the market, while maintaining or improving the accuracy of the sensor, it also effectively reduces the power budget of the product. We are very pleased that ST can join the Qualcomm platform solution ecosystem plan, in our Qualcomm®Snapdragon? mobile platform full time Turn on (always-on) low-power modules to integrate and optimize its advanced sensor algorithms. Cooperation with strategic suppliers such as ST is essential to accelerate the application of 5G technology in different vertical markets."

Andrea Onetti, vice president of ST's analog, MEMS and sensor products division and general manager of the MEMS sensor division, said: "We have worked closely with Qualcomm Technology for many years to ensure that the sensor performance meets the next generation of mobile devices, wearable devices, and supports Qualcomm® Sensors. The demanding requirements of software solutions in the Execution Environment environment include advanced functions, such as hinge or folding angle detection for smartphones and mobile PCs, and seamless integration of these functions, faster time to market, and meeting the needs of customers around the world. The low-cost high-accuracy IMU and the high-accuracy, reliable pressure sensor with extremely low time and temperature drift can achieve the highest positioning accuracy that can currently meet the requirements of e911 and eCall."